Replacement gate formation in memory

ABSTRACT

The present disclosure includes methods for replacement gate formation in memory, and apparatuses and systems including memory formed accordingly. An embodiment includes forming a first oxide material in an opening through alternating layers of a second oxide material and a nitride material. An array of openings can be formed through the first oxide material formed in the opening. The layers of the nitride material can be removed. A metal material can be formed in voids resulting from the removal of the layers of the nitride material.

TECHNICAL FIELD

The present disclosure relates generally to semiconductor memory andmethods, and more particularly, to replacement gate formation in memory.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuits and/or external removable devices in computers orother electronic devices. There are many different types of memoryincluding volatile and non-volatile memory. Volatile memory can requirepower to maintain its data and can include random-access memory (RAM),dynamic random access memory (DRAM), and synchronous dynamic randomaccess memory (SDRAM), among others. Non-volatile memory can providepersistent data by retaining stored data when not powered and caninclude NAND flash memory, NOR flash memory, read only memory (ROM), andresistance variable memory such as phase change random access memory(PCRAM), resistive random access memory (RRAM), magnetic random accessmemory (MRAM), and programmable conductive memory, among others.

Memory devices can be utilized as volatile and non-volatile memory for awide range of electronic applications in need of high memory densities,high reliability, and low power consumption. Non-volatile memory may beused in, for example, personal computers, portable memory sticks, solidstate drives (SSDs), digital cameras, cellular telephones, portablemusic players such as MP3 players, and movie players, among otherelectronic devices.

Resistance variable memory devices can include resistance variablememory cells that can store data based on the resistance state of astorage element (e.g., a memory element having a variable resistance).As such, resistance variable memory cells can be programmed to storedata corresponding to a target data state by varying the resistancelevel of the memory element. Resistance variable memory cells can beprogrammed to a target data state (e.g., corresponding to a particularresistance state) by applying sources of an electrical field or energy,such as positive or negative electrical pulses (e.g., positive ornegative voltage or current pulses) to the cells (e.g., to the memoryelement of the cells) for a particular duration. A state of a resistancevariable memory cell can be determined by sensing current through thecell responsive to an applied interrogation voltage. The sensed current,which varies based on the resistance level of the cell, can indicate thestate of the cell.

Various memory arrays can be organized in a cross-point architecturewith memory cells (e.g., resistance variable cells) being located atintersections of a first and second signal lines used to access thecells (e.g., at intersections of word lines and bit lines). Someresistance variable memory cells can comprise a select element (e.g., adiode, transistor, or other switching device) in series with a storageelement (e.g., a phase change material, metal oxide material, and/orsome other material programmable to different resistance levels). Someresistance variable memory cells, which may be referred to asself-selecting memory cells, can comprise a single material which canserve as both a select element and a storage element for the memorycell.

One of a number of data states (e.g., resistance states) can be set fora resistive memory cell. For example, a single level memory cell (SLC)can be programmed to a targeted one of two different data states, whichcan be represented by the binary units 1 or 0 and can depend on whetherthe cell is programmed to a resistance above or below a particularlevel. As an additional example, some resistive memory cells can beprogrammed to a targeted one of more than two data states (e.g., 1111,0111, 0011, 1011, 1001, 0001, 0101, 1101, 1100, 0100, 0000, 1000, 1010,0010, 0110, and 1110). Such cells may be referred to as multi statememory cells, multiunit cells, or multilevel cells (MLCs). MLCs canprovide higher density memories without increasing the number of memorycells because each cell can represent more than one digit (e.g., morethan one bit).

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1B illustrate various views of a processing step associatedwith forming a three-dimensional (3-D) memory array in accordance withan embodiment of the present disclosure.

FIGS. 2A-2B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIG. 3 illustrates a schematic cross-sectional view of a subsequentprocessing step associated with forming the 3-D memory array inaccordance with an embodiment of the present disclosure.

FIG. 4 illustrates a schematic cross-sectional view of a subsequentprocessing step associated with forming the 3-D memory array inaccordance with an embodiment of the present disclosure.

FIGS. 5A-5B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIGS. 6A-6B illustrate various views of subsequent processing stepsassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIGS. 7A-7B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIGS. 8A-8B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIGS. 9A-9B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIGS. 10A-10B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIGS. 11A-11B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIGS. 12A-12B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIGS. 13A-13B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIGS. 14A-14C illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIGS. 15A-15C illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIGS. 16A-16C illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIGS. 17A-17C illustrate various views of subsequent processing stepsassociated with forming the 3-D memory array in accordance with anembodiment of the present disclosure.

FIG. 18 illustrates a schematic of a 3-D memory array in accordance withan embodiment of the present disclosure.

FIG. 19 is a block diagram of an apparatus in the form of a memorydevice in accordance with an embodiment of the present disclosure.

DETAILED DESCRIPTION

The present disclosure includes replacement gate formation in memory.For instance, the present disclosure includes methods of processingthree-dimensional (3-D) memory arrays, which includes replacement gateformation and 3-D memory arrays formed in accordance with those methods.As used herein, “replacement gate formation” refers to processing ofmemory that includes formation of alternating layers of two insulatingmaterials in contrast to, for example, processing of memory thatincludes formation of alternating layers of an insulating material and aconductive material. Replacement gate formation includes removal of thelayers of one of the insulating materials and subsequently forming aconductive material in voids formed by removal of the layers of theinsulating material. A number of embodiments include forming a firstoxide material in an opening through alternating layers of twoinsulating materials a second oxide material and a nitride material. Anarray of openings can be formed through the first oxide material formedin the opening. The layers of the nitride material can be removed, and ametal material can be formed in voids resulting from the removal of thelayers of the nitride material.

In some previous approaches to memory processing, replacement gateformation may occur subsequent to formation of memory cells. Forexample, replacement gate formation may occur subsequent to formation ofmemory cells of previous 3-D memory arrays. In such previous approaches,the memory cells may be subjected to high temperatures associated withthe replacement gate formation, which may damage the memory cells (e.g.,the storage element material of the cell). To avoid damaging the memorycells, the temperatures used during replacement gate formation may belimited (e.g., to a maximum temperature that can be tolerated by thememory cells without resulting in damage to the cell). Limiting thetemperature used during the replacement gate formation, however, mayunnecessarily constrain the formation of the replacement gate. Forexample, higher temperatures can be useful for formation of metalmaterials in openings and/or voids of a 3-D memory array, especially inhigh-aspect ratio openings and/or voids. As used herein, an openinghaving a “high aspect ratio” refers to an opening where the depth of theopening is at least twenty-five times greater than a width or diameterof the opening (e.g., an aspect ratio of at least 10:1).

A number of embodiments of the present disclosure eliminate thisconstraint by, in contrast to previous approaches, performingreplacement gate formation prior to formation of memory cells.Accordingly, replacement gate formation, in accordance with the presentdisclosure, can occur at higher temperatures than those tolerable by thememory cells because the memory cells have not yet been formed. Becausethe replacement gate formation is not constrained, embodiments of thepresent disclosure can provide an interdigitated electrode structure foreach tier of a 3-D memory array. As used herein, a “tier” refers to apair of adjacent layers of an oxide material and a nitride material. Theoxide material and the nitride material of the tiers serve as supportmaterials of the 3-D memory array during and/or after processing of the3-D memory array.

As used herein, “a”, “an”, or “a number of” can refer to one or more ofsomething, and “a plurality of” can refer to two or more such things.For example, a memory device can refer to one or more memory devices,and a plurality of memory devices can refer to two or more memorydevices.

The figures herein follow a numbering convention in which the firstdigit or digits correspond to the drawing figure number and theremaining digits identify an element or component in the drawing.Similar elements or components between different figures may beidentified by the use of similar digits. For example, 104 may referenceelement “04” in FIG. 1B, and a similar element may be referenced as 204in FIG. 2B. The figures herein are not meant to imply or indicatespecific dimensions.

FIGS. 1A-1B illustrate various views of a processing step associatedwith forming a 3-D memory array in accordance with an embodiment of thepresent disclosure. For example, FIG. 1A illustrates a top view of a 3-Dmemory array 100 after the processing step. FIG. 1B illustrates aschematic cross-sectional view of the 3-D memory array 100 along sectionline A-A in FIG. 1A after the processing step.

As illustrated by FIG. 1B, a plurality of alternating layers of an oxidematerial 104 and a nitride material 106 can be formed (e.g., deposited)on a substrate material (not shown). A non-limiting example of asubstrate material can be a semiconductor wafer. A layer of the oxidematerial 104 and the directly adjacent layer of the nitride material 106can be referred to as a tier of the 3-D memory array 100. The combinedthickness of the layers of the oxide material 104 and the nitridematerial 106 of a tier can be referred to as a tier pitch. Although 10tiers of the 3-D memory array 100 are illustrated by FIG. 1B,embodiments are not so limited. For example, the 3-D memory array 100can include greater (e.g., at least 64 tiers, 300 tiers), or fewer,quantities of tiers.

As illustrated by FIGS. 1A-1B an opening 102 can be formed through thealternating layers of the oxide material 104 and the nitride material106. FIG. 1A illustrates the opening 102 being a serpentine opening(e.g., a serpentine-shaped opening). However, embodiments of the presentdisclosure are not limited the opening being serpentine or being asingle, continuous opening. For example, a number of embodiments caninclude a plurality of discrete openings formed through the alternatinglayers of the oxide material 104 and the nitride material 106.

An etching operation, such as a serpentine etch, can be performed toform the opening 102. A serpentine opening, such as the opening 102, canprovide interdigitated “fingers” of the 3-D memory array 100 that canserve as word lines of the 3-D memory array 100. The opening 102 can beformed using a hardmask. As illustrated by cross-sectional view of FIG.1B, the opening 102 is formed through the alternating layers of theoxide material 104 and the nitride material 106. The opening 102 can bea high aspect ratio opening.

FIGS. 2A-2B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array 200 in accordance with anembodiment of the present disclosure. For example, FIG. 2A illustrates atop view of the 3-D memory array 200 after the subsequent processingstep. FIG. 2B illustrates a schematic cross-sectional view of the 3-Dmemory array 200 along the section line A-A in FIG. 2A after thesubsequent processing step.

As illustrated by FIGS. 2A-2B, an oxide material 210 can be formed inthe opening 202. Non-limiting examples of the oxide material 204 includetetraethyl orthosilicate (TEOS) and aluminum oxide (AlOx). The oxidematerial 210 can be a different material than the oxide material 204.Embodiments of the present disclosure are not limited to forming anoxide material (e.g., the oxide material 210) in the opening 202. Forexample, a dielectric material that has wet etch and/or dry etchselectivity to the nitride material 206 can be formed in the opening202.

As illustrated by FIG. 2B, the oxide material 210 can completely fillthe opening 202 through the alternating layers of the oxide material 204and the nitride material 206. In a number of embodiments, the oxidematerial 210 can be formed via a deposition operation. The deposition ofthe oxide material 210 can be a highly conformal deposition due to thehigh aspect ratio of the opening 202. A chemical-mechanical polishing(CMP) operation can be performed to remove any excess of the oxidematerial 210.

FIG. 3 illustrates a schematic cross-sectional view of a subsequentprocessing step associated with forming the 3-D memory array 300 inaccordance with an embodiment of the present disclosure. As illustratedby FIG. 3 , a staircase structure 312 (e.g., a staircase-shapedstructure) can be formed by removing portions of the alternating layersof the oxide material 304 and the nitride material 306. For instance, adifferent amount (e.g., a sequentially increasing amount) of eachrespective layer of oxide material 304 and nitride material 306 can beremoved to form the staircase-shaped structure 312 shown in FIG. 3 .Although the staircase structure 312 is illustrated including 6 tiers ofthe 3-D memory array 300, the staircase structure 312 can be formed onany number (e.g., all) of the tiers of the 3-D memory array 300. Thestaircase structure 312 can be formed by performing an etch operation ona peripheral area of a semiconductor wafer (not shown) on which theportions of the alternating layers of the oxide material 304 and thenitride material 306 are formed. Contacts can be formed on the staircasestructure 312 in later processing steps associated with formation of the3-D memory array 300.

FIG. 4 illustrates a schematic cross-sectional view of a subsequentprocessing step associated with forming the 3-D memory array 400 inaccordance with an embodiment of the present disclosure. As illustratedby FIG. 4 , an oxide material 414 can be formed on the staircasestructure 412. The oxide material 414 can be a same material as or adifferent material than any of the oxide material 404 and the oxidematerial 410. A non-limiting example of the oxide material 414 can beTEOS. In a number of embodiments, the oxide material 414 can be formedvia a deposition operation. A CMP operation can be performed to removeexcess of the oxide material 414 from the oxide material 404. The CMPoperation results in the topmost surface of the oxide material 414 andthe topmost surface of the oxide material 404 to be coplanar or nearlycoplanar.

FIGS. 5A-5B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array 500 in accordance with anembodiment of the present disclosure. For example, FIG. 5A illustrates atop view of the 3-D memory array 500 after the subsequent processingstep. FIG. 5B illustrates a schematic cross-sectional view of the 3-Dmemory array 500 along the section line B-B in FIG. 5A after thesubsequent processing step.

As illustrated by FIGS. 5A-5B, an array of openings 516 can be formedthrough the alternating layers of the oxide material 504 and the nitridematerial 506, and through the oxide material 514 and the staircasestructure (the staircase structure 412 described in association withFIG. 4 ). Although FIG. 5A illustrates the array of openings 516 ashaving three rows of openings, the array of openings 516 can includegreater, or fewer, quantities of rows of openings.

It is noted that the term “row” is used based on the orientation of the3-D memory array 500 as illustrated by FIG. 5A. If FIG. 5A is rotated 90degrees, then the term “column” could be used. The rows 522, 524, and526 could be referred to as respective columns of the array of openings516.

The array of openings 516 can be formed on a peripheral area of thealternating layers of the oxide material 504 and the nitride material506 relative to a semiconductor wafer (not shown) on which thealternating layers of the oxide material 504 and the nitride material506 are formed. A portion of the array of openings 516 can be used inlater processing steps associated with formation of contacts of the 3-Dmemory array 500. As described further herein, the array of openings 516can be used to form one or more support structures for the 3-D memoryarray 500. For instance, the array of openings 516 can be used to form atemporary support structure during further processing of the 3-D memoryarray. Further, the array of openings 516 can be used to form apermanent support structure that persists beyond processing of the 3-Dmemory array 500. A size of the openings of the array 516 and/or spacingbetween the openings of the array 516 can be based on supportrequirements of the 3-D memory array 500 during and/or after processingof the 3-D memory array 500 (e.g., during replacement gate formation asdescribed herein).

FIGS. 6A-6B illustrate various views of subsequent processing stepsassociated with forming the 3-D memory array 600 in accordance with anembodiment of the present disclosure. For example, FIG. 6A illustrates atop view of the 3-D memory array 600 after the subsequent processingsteps. FIG. 6B illustrates a schematic cross-sectional view of the 3-Dmemory array 600 along the section line E-E in FIG. 6A after thesubsequent processing steps.

FIG. 6A illustrates a polysilicon material 628 formed in (e.g., used tofill) the array of openings 616. As illustrated by FIG. 6A, thepolysilicon material 628 can be formed in the array of openings 616. Forexample, the polysilicon material 628 is formed in rows 622, 624, and626 of the array of openings 616.

The polysilicon material 628 can be formed in the array of openings 616via a deposition operation, for example. A CMP operation can beperformed subsequently to remove excess of the polysilicon material 628from the oxide materials 604 and/or 614.

As illustrated by FIG. 6B, the polysilicon material 628 can fillopenings of the array of openings 616 completely. The polysiliconmaterial 628 formed in the array of opening 616 can provide a temporarysupport structure for the 3-D memory array 600 during processing of the3-D memory array 600. For example, the polysilicon material 628 canprovide support to prevent the staircase structure 612 from saggingand/or collapsing during further processing of the 3-D memory array 600.

FIGS. 7A-7B illustrate various views of subsequent processing stepsassociated with forming the 3-D memory array 700 in accordance with anembodiment of the present disclosure. For example, FIG. 7A illustrates atop view of the 3-D memory array 700 after the subsequent processingsteps. FIG. 7B illustrates a schematic cross-sectional view of the 3-Dmemory array 700 along the section line E-E in FIG. 7A after thesubsequent processing steps.

As illustrated by FIGS. 7A-7B, a photoresist material 729 can be formedon the 3-D memory array 700. Subsequently, one or more portions of thephotoresist material 729 can be removed from the 3-D memory array 700.For example, lithography can be used to remove a portion of thephotoresist material 729 formed on openings of the array 716 in which anoxide material is to be formed (the openings of row 722). In otherwords, a portion of the photoresist material 729 formed over openings ofthe array 716 in which contacts are to be formed can be removed bylithography. A non-limiting example of lithography can be a stripepattern.

FIGS. 8A-8B illustrate various views of subsequent processing stepsassociated with forming the 3-D memory array 800 in accordance with anembodiment of the present disclosure. For example, FIG. 8A illustrates atop view of the 3-D memory array 800 after the subsequent processingsteps. FIG. 8B illustrates a schematic cross-sectional view of the 3-Dmemory array 800 along the section line E-E in FIG. 8A after thesubsequent processing steps.

As illustrated by FIGS. 8A-8B, the polysilicon material 828 can beselectively removed from a subset of the array of openings 816. Thepolysilicon material 828 can be selectively removed from openings of thearray 816 that are not covered by the photoresist material 829 (theopenings of row 822). The photoresist material 829 can prevent removalof the polysilicon material 828 from the remainder of the array ofopenings 816. In a number of embodiments, lithography can be performedto remove at least a portion of the polysilicon material 828 fromrespective openings of alternating rows of the array of openings 816. Anon-limiting example of lithography can be a stripe pattern. An etchoperation, such as a wet etch operation, can be performed to remove thepolysilicon material 828 from the array of openings 816. For example, anetch operation can be performed to remove remains of the polysiliconmaterial 828 in the subset of the array of openings 816 (e.g., theopenings of the row 822) that was not removed by lithography. The etchoperation can be performed using tetramethylammonium hydroxide (TMAH),for example.

FIGS. 9A-9B illustrate various views of subsequent processing stepsassociated with forming the 3-D memory array 900 in accordance with anembodiment of the present disclosure. For example, FIG. 9A illustrates atop view of the 3-D memory array 900 after the subsequent processingsteps. FIG. 9B illustrates a schematic cross-sectional view of the 3-Dmemory array 900 along the section line E-E in FIG. 9A after thesubsequent processing steps.

As illustrated by FIGS. 9A-9B, the photoresist material can be removedfrom the 3-D memory array 900. The photoresist material can be removedsubsequent to removal of the polysilicon material 928 from the subset ofthe array of openings 916. A photoresist strip can be performed toremove the photoresist material.

FIGS. 10A-10B illustrate various views of subsequent processing stepsassociated with forming the 3-D memory array 1000 in accordance with anembodiment of the present disclosure. For example, FIG. 10A illustratesa top view of the 3-D memory array 1000 after the subsequent processingsteps. FIG. 10B illustrates a schematic cross-sectional view of the 3-Dmemory array 1000 along the section line B-B in FIG. 10A after thesubsequent processing steps.

As illustrated by FIGS. 10A-10B, an oxide material 1020 can be formed ina subset of openings of the array 1016. For example, subsequent to theremoval of the polysilicon material 1028 from the subset (e.g., the row1022) of the array of openings 1016, the oxide material 1020 can beformed in the subset of the array of openings 1016 via a depositionoperation, for example. A CMP operation can be performed subsequently toremove excess of the oxide material 1020 from the oxide material 1004,the oxide material 1014, and/or the polysilicon material 1028. The oxidematerial 1020 formed in the array of openings 1016 can persist duringfurther processing of the 3-D memory array 1000 to provide a permanentsupport structure of the 3-D memory array 1000 in contrast to thetemporary support structure provided by the polysilicon material 1028.The oxide material 1020 formed in the array of openings 1016 can bereferred to as support pillars and can prevent the staircase structure1012 from sagging and/or collapsing. Non-limiting examples of the oxidematerial 1020 can include TEOS, silicon oxide material, such as silicondioxide (SiO₂), and AlOx. The oxide material 1020 can be a same materialas or a different material than the oxide materials 1004 and/or 1010.

FIGS. 11A-11B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array 1100 in accordance with anembodiment of the present disclosure. For example, FIG. 11A illustratesa top view of the 3-D memory array 1100 after the subsequent processingstep. FIG. 11B illustrates a schematic cross-sectional view of the 3-Dmemory array 1100 along the section line C-C in FIG. 11A after thesubsequent processing step.

As illustrated by FIGS. 11A-11B, an array of openings 1130 can be formedthrough the oxide material 1110 formed in the opening 1102. In a numberof embodiments, openings of the array of openings 1130 can extend intothe layers of the oxide material 1104 and the nitride material 1106 butbe primarily formed through the oxide material 1110 formed in theopening 1102. The array of openings 1130 can be associated withformation of an array of memory cells in subsequent processing steps ofprocessing the 3-D memory array 1100. As illustrated by FIG. 11B, thearray of openings 1130 can be formed through the entire depth of theoxide material 1110 formed in the opening 1102 such that the array ofopenings 1130 pass through all tiers of the 3-D memory array 1100. In anumber of embodiments, the array of openings 1130 can be formed via aselective etch operation relative to the oxide material 1104 and thenitride material 1106. As described herein, the oxide material 1110 canbe a support material.

Although described separately herein and formed separately, the array ofopenings 1116 and the array of openings 1130 can be considered as asingle array of openings. The single array of openings can be consideredas including two sections. One section can be the array of openings 1116and another section can be the array of openings 1130. In someembodiments, the arrays of openings 1116 and 1130 can be formedconcurrently are created simultaneously, but filled separately. Forexample, lithography can be used to mask one of the arrays of openings1116 and 1130 with respect to the other one of the arrays of openings116 and 1130.

FIGS. 12A-12B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array 1200 in accordance with anembodiment of the present disclosure. For example, FIG. 12A illustratesa top view of the 3-D memory array 1200 after the subsequent processingstep. FIG. 12B illustrates a schematic cross-sectional view of the 3-Dmemory array 1200 along the section line C-C in FIG. 12A after thesubsequent processing step.

As illustrated by FIGS. 12A-12B, the polysilicon material 1228 (e.g.,the polysilicon material 1128 described in association with FIGS.11A-11B) can be removed from the array of openings 1216. The polysiliconmaterial 1128 can be removed from the rows 1224 and 1226 of the array ofopenings 1216. The polysilicon material 1128 can be removed from thearray of openings 1216 via an etch operation, for example. The etchoperation can be a wet etch operation. The etch operation can beselective relative to the oxide materials 1204 and 1214 and/or thenitride material 806. The etch operation can be performed using TMAH,for example.

FIGS. 13A-13B illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array 1300 in accordance with anembodiment of the present disclosure. For example, FIG. 13A illustratesa top view of the 3-D memory array 1300 after the subsequent processingstep. FIG. 13B illustrates a schematic cross-sectional view of the 3-Dmemory array 1300 along the section line B-B in FIG. 13A after thesubsequent processing step.

As illustrated by FIG. 13B, the layers of the nitride material (e.g.,the nitride material 1206 described in association with FIGS. 12A-12B)can be removed from the 3-D memory array 1300, which can form voidsbetween the layers of oxide material 1304 in 3-D memory array 1300, asdescribed in association with FIGS. 13A-13B. In a number of embodiments,the layers of the nitride material can be removed from the 3-D memoryarray 1300 via wet nitride material strip processing. A hot phosphoricacid, for example can be used for the wet nitride strip processing. Asdescribed in association with FIGS. 6A-6B, the oxide material 1320formed in the array of openings 1316 can provide support for the layersof the oxide material 1304. The oxide material 1310 formed in theopening 1302 (can be referred to as support pillars) can provide supportfor the layers of the oxide material 1304.

FIGS. 14A-14C illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array 1400 in accordance with anembodiment of the present disclosure. For example, FIG. 14A illustratesa top view of the 3-D memory array 1400 after the subsequent processingstep. FIG. 14B illustrates a schematic cross-sectional view of the 3-Dmemory array 1400 along the section line D-D in FIG. 14C after thesubsequent processing step. FIG. 14B illustrates a word line of the 3-Dmemory array 1400. FIG. 14C illustrates a schematic cross-sectional viewof the 3-D memory array 1400 along the section line B-B in FIGS. 14A-14Bafter the subsequent processing step.

As illustrated by FIGS. 14A-14C, a metal material 1434 can be formed inthe voids of the 3-D memory array 1400 resulting from removal of thelayers of the nitride material 1306 described in association with FIGS.13A-13B. The metal material 1434 formed in the voids are replacementgates. A non-limiting example of the metal material 1434 can be atungsten material. In a number of embodiments, the metal material 1434can be formed in the voids via a deposition operation. The depositionoperation can use a conformal tungsten material. In a number ofembodiments, a nucleation layer material (not shown) can be formed inthe voids prior to formation of the metal material 1434. A non-limitingexample of a nucleation layer material can be a titanium nitridematerial. A CMP operation can be performed subsequently to remove excessof the metal material 1434 (and nucleation later material, if present)from topmost layers of the oxide materials 1404 and/or 1414.

As illustrated by FIGS. 14A-14C, the deposition operation can cause themetal material 1434 to be partially formed in the array of openings 1416and the array of openings 1430. The thickness of the metal material 1434can be such that the voids between the layers of the oxide material 1404are filled completely but that the array of openings 1416 and the arrayof openings 1430 are filled partially, if at all. The height of thevoids, which are dependent on the thickness of respective layers of thenitride material 1306, can be such that completely filling the voidswith the metal material 1434 does not cause the array of openings 1416and the array of openings 1430 to be pinched off by the metal material1434.

FIGS. 15A-15C illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array 1500 in accordance with anembodiment of the present disclosure. For example, FIG. 15A illustratesa top view of the 3-D memory array 1500 after the subsequent processingstep. FIG. 15B illustrates a schematic cross-sectional view of the 3-Dmemory array 1500 along the section line D-D in FIG. 15C after thesubsequent processing step. FIG. 15B illustrates word lines of the 3-Dmemory array 1500. The word lines are interdigitated and electricallyisolated from one another. FIG. 15C illustrates a schematiccross-sectional view of the 3-D memory array 1500 along the section lineB-B in FIGS. 15A-15B after the subsequent processing step.

As illustrated by FIGS. 15A-15C, the metal material 1534 can be removedfrom the array of openings 1516 and the array of openings 1530. In anumber of embodiments, the metal material 1534 can be removed from thearray of openings 1516 and the array of openings 1530 via an etchoperation. The etch operation can be a wet etch operation. The etchoperation can be controllably selective to remove the metal material1534 from vertical surfaces of the array of openings 1516 and the arrayof openings 1530 while minimizing removal of the metal material 1534from between the layers of the oxide material 1504. The etch operationcan be selective relative to the oxide materials 1504, 1510, and/or1514.

In a number of embodiments, a barrier layer material and/or a memorycell interfacial layer material (not shown) can be deposited in thevoids prior to formation of the metal material 1534. The barrier layermaterial and/or the memory cell interfacial layer material can protectthe oxide materials 1504, 1510, and/or 1514 from the etch operation toremove the metal material 1534 from the array of openings 1516 and thearray of openings 1530. A non-limiting example of a barrier layermaterial and/or a memory cell interfacial layer material can be atitanium nitride material. The barrier layer material can be removed(subsequent to etch operation or during the etch operation), selectivelyrelative to the oxide materials 1504, 1510, and 1514 and the metal 1134,to electrically isolate the metal material 1534 of a tier from the metalmaterial 1534 of adjacent tiers (e.g., the tier above and the tierbelow).

FIGS. 16A-16C illustrate various views of a subsequent processing stepassociated with forming the 3-D memory array 1600 in accordance with anembodiment of the present disclosure. For example, FIG. 16A illustratesa top view of the 3-D memory array 1600 after the subsequent processingstep. FIG. 16B illustrates a schematic cross-sectional view of the 3-Dmemory array 1600 along the section line D-D in FIG. 16C after thesubsequent processing step. FIG. 16B illustrates a word line of the 3-Dmemory array 1600. FIG. 16C illustrates a schematic cross-sectional viewof the 3-D memory array 1600 along the section line B-B in FIGS. 16A-16Bafter the subsequent processing step.

As illustrated by FIGS. 16A-16C, a polysilicon material 1636 can beformed in a subset of the array of openings 1616 (e.g., the rows 1624and 1626) and the array of openings 1630 subsequent to formation of themetal material 1634. The polysilicon material 1636 can be formed via adeposition operation, for example. The polysilicon material 1636 can beformed in the array of openings 1630 via a same or different depositionoperation that formed the polysilicon material 1636 in the array ofopenings 1616. If different deposition operations are used, then adifferent polysilicon material can be formed in the array of openings1616 than in the array of openings 1630. A CMP operation can beperformed subsequently to remove excess of the polysilicon material 1636from the oxide materials 1604 and/or 1614. The polysilicon material 1636can be formed in the same subset of the array of openings 1616 as thepolysilicon material 628 as described in association with FIGS. 6A-6B.The polysilicon material 1636 can be a same material as or a differentmaterial than the polysilicon material 628. In a number of embodiments,a barrier layer material (not shown) can be formed in the subset of thearray of openings 1616 prior to forming the polysilicon material 1636.The barrier layer material can prevent reactions between the metalmaterial 1634 and the polysilicon material 1636. A non-limiting exampleof a barrier material can be titanium nitride.

As illustrated by FIG. 16C, the polysilicon material 1636 can fillopenings of the array of openings 1616 completely. The polysiliconmaterial 1636 can be a support material. The polysilicon material 1636formed in the array of opening 1616 can provide a temporary supportstructure for the 3-D memory array 1600 during further processing of the3-D memory array 1600. The polysilicon material 1636 can enableindependent processing of an array of memory cells of the 3-D memoryarray 1600 (to be formed in the array of openings 1630) separate fromprocessing of structures in the periphery of the 3-D memory array 1600.

FIGS. 17A-17C illustrate various views of subsequent processing stepsassociated with forming the 3-D memory array 1700 in accordance with anembodiment of the present disclosure. For example, FIG. 17A illustratesa top view of the 3-D memory array 1700 after the subsequent processingsteps. FIG. 17B illustrates a schematic cross-sectional view of the 3-Dmemory array 1700 along the section line D-D in FIG. 17C after thesubsequent processing steps. FIG. 17B illustrates a word line of the 3-Dmemory array 1700. FIG. 17C illustrates a schematic cross-sectional viewof the 3-D memory array 1700 along the section line B-B in FIGS. 17A-17Bafter the subsequent processing steps.

As illustrated by FIGS. 17A-17C, a metal material 1738 can be formed ina subset of the array of openings 1716 (e.g., the rows 1724 and 1726).Forming the metal material 1738 can be associated with processing ofcontacts of the 3-D memory array 1700. A non-limiting example of themetal material 1738 can be a tungsten material or a titanium material.

In a number of embodiments, the polysilicon material 1636 formed in thearray of openings 1716, as described in association with FIGS. 16A-16C,can be removed prior to forming the metal material 1738. The polysiliconmaterial 1736 in the array of openings 1730 can prevent the metalmaterial 1738 from forming in the array of openings 1730. Lithographycan be performed to remove at least a portion of the polysiliconmaterial 1636 from respective openings of alternating rows of the arrayof openings 1716. A non-limiting example of lithography can be a stripepattern. The polysilicon material 1636 can be removed from the array ofopenings 1716 via an etch operation, for example. The etch operation canbe a wet etch operation. The etch operation can be selective relative tothe oxide materials 1704 and 1714. The etch operation can be performedusing TMAH, for example. If the polysilicon material 1636 was formed ona barrier material, such as titanium nitride, then the etch operationcan include removing the barrier layer material. The etch operation caninclude removing a barrier layer material using an ammonia peroxidemixture (APM).

In a number of embodiments, an oxide liner material 1740 can be formedin the array of openings 1716 prior to forming the metal material 1738in the array of openings 1716. As illustrated by FIG. 17C, the oxideliner material 1740 is formed through the layers of the oxide material1704 and the metal material 1734. The oxide liner material 1740 canelectrically isolate the metal material 1734, which can comprise wordlines of the 3-D memory array 1700, from the metal material 1738, whichcan comprise contacts of the 3-D memory array 1700. Non-limitingexamples of the oxide liner material 1740 can include TEOS, siliconoxide material, such as silicon dioxide (SiO₂), and AlOx. The metalmaterial 1738 can be formed on the oxide liner material 1740. The metalmaterial 1738 can fill voids in the array of openings 1716 resultingfrom forming the oxide liner material 1740.

In a number of embodiments, the metal material 1738 can be formed in asubset of the array of openings 1716 via a deposition operation. Anucleation layer material (not shown) can be formed in the subset of thearray of openings 1716 prior to formation of the metal material 1738. Anon-limiting example of a nucleation layer material can be a titaniumnitride material. A CMP operation can be performed subsequently toremove excess of the metal material 1738 from the oxide materials 1704and/or 1714.

In a number of embodiments, processing of the 3-D memory array 1700subsequent to forming the metal material 1738 can include removing thepolysilicon material 1736 from the array of openings 1730. Lithographycan be performed to remove at least a portion of the polysiliconmaterial 1736 from the array of openings 1730. A non-limiting example oflithography can be a stripe pattern. The polysilicon material 1736 canbe removed from the array of openings 1730 via an etch operation, forexample. The etch operation can be a wet etch operation. The etchoperation can be selective relative to the oxide materials 1704 and1714. The etch operation can be performed using TMAH, for example. Ifthe polysilicon material 1736 was formed on a barrier material, such astitanium nitride, then the etch operation can include removing thebarrier layer material. The etch operation can include removing abarrier layer material using an APM. Subsequent to removing thepolysilicon material 1736, processing of the 3-D memory array 1700 caninclude processing of an array of memory cells of the 3-D memory array1700 in the openings resulting from removal of the polysilicon material1736.

Although not specifically illustrated by FIGS. 1A-17C, memory cells canbe formed in the array of openings 1730. Subsequent to removing thepolysilicon material 1736 from the array of openings 1730 (e.g., byapplying TMAH to the polysilicon material 1736), memory cells can beformed in the array of openings 1730 by forming a storage elementmaterial in the array of openings 1730. In some embodiments, the storageelement material can be capable of storing at least two binary states ofelectronic information. The storage element material can be an activememory material, such as a chalcogenide material. The memory cells caninclude one or more electrodes on one or multiple sides of an activememory material to promote electrical connection to the metal material1734 and to a conductive material formed in the array of openings 1730subsequent to formation of electrodes and/or the active memory material.The conductive material can be referred to as a bitline and/or achannel. The memory cells can be isolated between the tiers of the metalmaterial 1734 by any of a number of techniques known to persons ofordinary skill in the art (e.g., semiconductor processing).

Although not specifically illustrated as such, the 3-D memory array 1700can be a multi-deck array. The tiers of the 3-D memory array 1700illustrated by FIGS. 17A-17C can be considered a deck. Multi-deckprocessing can be performed in multiple ways. One way is to repeat ofthe processing described herein to form another deck on the deckillustrated in FIGS. 17A-17C. Another way is to fill all openings shownafter FIG. 11 with a polysilicon material. Then the processing stepsdescribed in association with FIGS. 1-11 can be repeated to form anotherdeck. The polysilicon material can then be removed from both decks (in asingle operation) and the processing steps described in association withFIGS. 12-17C can be performed on the decks concurrently.

FIG. 18 illustrates a schematic of a 3-D memory array 1880 in accordancewith an embodiment of the present disclosure. The 3-D memory array 1880can be processed according to the processing steps described inassociation with FIGS. 1A-17C. Although FIG. 18 illustrates a square orrectangular arrangement of a plurality of conductive lines 1882, aplurality of conductive lines 1886, and a plurality of memory cells1884, it will be appreciated that FIG. 18 is a schematic representationof the 3-D memory array 1880 and that the plurality of conductive lines1882, a plurality of conductive lines 1886, and a plurality of memorycells 1884 can be formed as described in association with FIGS. 1A-17Cabove.

As shown in FIG. 18 , access lines (also referred to as word lines) canbe disposed on a plurality of tiers. For example, access lines can bedisposed on a quantity (N) of tiers. An insulation material, such as thelayers of the oxide material 1704 illustrated by FIGS. 17A-17C, (notshown in FIG. 18 for clarity and so as not to obscure embodiments of thepresent disclosure) can separate the tiers of access lines, such as themetal material 1734. As such, the tiers of access lines separated by theinsulation material can form a stack of access lines/insulationmaterials.

Data lines can be arranged substantially perpendicular to the accesslines and located at a level above the N tiers of access lines (e.g., atthe N+1 level). For example, the 3-D memory array 1880 can include aplurality of conductive lines 1882 (e.g., access lines) and a pluralityof conductive lines 1886 (e.g., data lines). The plurality of conductivelines 1882 can be arranged into a plurality of tiers. As illustrated inFIG. 18 , the plurality of conductive lines 1882 are arranged intotiers. The plurality of conductive lines 1882 are arranged substantiallyparallel to one another within each respective tier. The plurality ofconductive lines 1882 can be aligned vertically in a stack. Forinstance, the plurality of conductive lines 1882 in each of the multipletiers can be located at a same relative location within each respectivetier so as to be aligned with the plurality of conductive lines 1882 inthe tier directly above and/or below. An insulation material can belocated between the tiers at which the plurality of conductive lines1886 are formed.

As shown in FIG. 18 , the plurality of conductive lines 1886 can bearranged substantially parallel to one another at a tier different thanthe tier at which the plurality of conductive lines 1882 are located(e.g., above the tiers at which the plurality of conductive lines 1882are located). For instance, the plurality of conductive lines 1886 canbe located at the bottom of the memory array 1880.

The indices shown in FIG. 18 for each of the plurality of conductivelines 1882 indicate a particular tier and the position (e.g., ordering)of the plurality of conductive lines 1882 within that tier. For example,the conductive line having the index WL_(2,0) is located at position 2within tier 0 (e.g., an access line of the 3-D memory array 1880 locatedat the bottom of a stack of access lines located at position 2). Theconductive line having the index WL_(2,3) is located at position 2within tier 3 (e.g., an access line of the 3-D memory array 1880 locatedat the top of a stack of access lines located at position 2). Thequantity of tiers into which the plurality of conductive lines 1882 canbe arranged and the quantity of the plurality of conductive lines 1882at each tier can be greater, or fewer, than the quantities shown in FIG.18 .

At each overlapping of one of the plurality of conductive lines 1886 anda stack of the plurality of conductive lines 1882, a conductive pillaris oriented substantially perpendicular to the plurality of conductivelines 1886 and the plurality of conductive lines 1882 so as to intersecta portion of each the plurality of conductive lines 1882 in the stack.

FIG. 19 is a block diagram of an apparatus in the form of a memorydevice 1990 in accordance with an embodiment of the present disclosure.As used herein, an “apparatus” can refer to, but is not limited to, anyof a variety of structures or combinations of structures, such as acircuit or circuitry, a die or dies, a module or modules, a device ordevices, or a system or systems, for example. As illustrated by FIG. 19, the memory device 1990 can include a 3-D memory array 1994. The 3-Dmemory array 1994 can be processed according to the processing stepsdescribed in association with FIGS. 1A-17C. Although FIG. 19 shows asingle 3-D memory array 1994 for clarity and so as not to obscureembodiments of the present disclosure, the memory device 1990 mayinclude any quantity of the 3-D memory array 1994.

As shown in FIG. 19 , the memory device 1990 can include decodingcircuitry 1992 coupled to the 3-D memory array 1994. The decodingcircuitry 1992 can be included on the same physical device (e.g., thesame die) as the 3-D memory array 1994. The decoding circuitry 1992 canbe included on a separate physical device that is communicativelycoupled to the physical device that includes the 3-D memory array 1994.

The decoding circuitry 1992 can receive and decode address signals toaccess the memory cells (e.g., the memory cells 1884 illustrated in FIG.18 ) of the 3-D memory array 1994 during program and/or sense operationsperformed on the 3-D memory array 1994. For example, the decodingcircuitry 1992 can include portions of decoder circuitry for use inselecting a particular memory cell of the 3-D memory array 1994 toaccess during a program or sense operation. For instance, a firstportion of the decoder circuitry can be used to select a data line and asecond portion of the decoder circuitry can be used to select an accessline. The decoding circuitry 1992 can, during a program operation orsense operation performed on the 3-D memory array 1994, apply an accessvoltage to one of the plurality of vertical stacks (e.g., the verticalstacks shown in and described in association with FIG. 18 ) and one ofthe plurality of conductive lines (e.g., one of the plurality ofconductive lines 1882).

The embodiment illustrated in FIG. 19 can include additional circuitry,logic, and/or components not illustrated so as not to obscureembodiments of the present disclosure. For example, the memory device1990 can include a controller to send commands to perform operations onthe 3-D memory array 1994, such as operations to sense (e.g., read),program (e.g., write), move, and/or erase data, among other operations.Further, the memory device 1990 can include address circuitry to latchaddress signals provided over input/output (I/O) connectors through I/Ocircuitry. Further, the memory device 1990 can include a main memory,such as, for instance, a DRAM or SDRAM, that is separate from and/or inaddition to the memory array(s) 1994.

Although specific embodiments have been illustrated and describedherein, those of ordinary skill in the art will appreciate that anarrangement calculated to achieve the same results can be substitutedfor the specific embodiments shown. This disclosure is intended to coveradaptations or variations of a number of embodiments of the presentdisclosure. It is to be understood that the above description has beenmade in an illustrative fashion, and not a restrictive one. Combinationof the above embodiments, and other embodiments not specificallydescribed herein will be apparent to those of ordinary skill in the artupon reviewing the above description. The scope of a number ofembodiments of the present disclosure includes other applications inwhich the above structures and methods are used. Therefore, the scope ofa number of embodiments of the present disclosure should be determinedwith reference to the appended claims, along with the full range ofequivalents to which such claims are entitled.

In the foregoing Detailed Description, some features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the disclosed embodiments of the presentdisclosure have to use more features than are expressly recited in eachclaim. Rather, as the following claims reflect, inventive subject matterlies in less than all features of a single disclosed embodiment. Thus,the following claims are hereby incorporated into the DetailedDescription, with each claim standing on its own as a separateembodiment.

What is claimed is:
 1. A method of processing memory, comprising:forming a first oxide material in an opening through alternating layersof a second oxide material and a nitride material; forming an array ofopenings through the first oxide material formed in the opening;removing the layers of the nitride material; forming a metal material invoids resulting from the removal of the layers of the nitride material;forming an additional array of openings through the alternating layersof the second oxide material and the nitride material; and forming athird oxide material in a subset of the openings of the additionalarray.
 2. The method of claim 1, further comprising forming apolysilicon material in the openings of the additional array prior toforming the array of openings and forming the third oxide material. 3.The method of claim 2, further comprising selectively removing, via awet etch operation, the polysilicon material from the subset of theopenings of the additional array prior to forming the array of openings.4. The method of claim 2, further comprising removing, via a wet etchoperation, the polysilicon material from the openings of the additionalarray prior to removing the layers of the nitride material.
 5. Themethod of claim 1, further comprising forming an additional metalmaterial in an additional subset of the openings of the additionalarray.
 6. The method of claim 5, wherein forming the additional metalmaterial comprises forming a tungsten material or a titanium material inthe additional subset of the openings of the additional array.
 7. Themethod of claim 5, further comprising forming a liner material in theadditional subset of the openings of the additional array prior toforming the additional metal material in the additional subset of theopenings.
 8. The method of claim 1, wherein forming the metal materialcomprises forming a tungsten material in the voids resulting from theremoval of the layers of the nitride material.
 9. The method of claim 1,further comprising: forming the first oxide material in an openingthrough another set of alternating layers of the second oxide materialand the nitride material formed on the alternating layers of the secondoxide material and the nitride material; forming another array ofopenings through the first oxide material formed in the opening throughthe other set of alternating layers of the second oxide material and thenitride material; removing the layers of the nitride material from theother set of alternating layers of the second oxide material and thenitride material; and forming a metal material in voids resulting fromthe removal of the layers of the nitride material from the other set ofalternating layers of the second oxide material and the nitridematerial.
 10. A method of processing memory, comprising: forming aserpentine opening through alternating layers of a first oxide materialand a nitride material; forming a second oxide material in theserpentine opening; forming a temporary support material through thealternating layers of the first oxide material and the nitride material;forming, while the temporary support material is in place, an array ofopenings through the second oxide material; removing a portion of thetemporary support material subsequent to forming the array of openingsthrough the second oxide material; removing the layers of the nitridematerial subsequent to removing the portion of the temporary supportmaterial; forming a metal material in voids between the layers of thefirst oxide material resulting from the removal of the layers of thenitride material; and forming a polysilicon material in a first subsetof an additional array of openings through the alternating layers of thefirst oxide material and the nitride material; and forming a third oxidematerial in a second subset of the additional array of openings throughthe alternating layers of the first oxide material and the nitridematerial.
 11. The method of claim 10, wherein forming the temporarysupport material comprises forming a polysilicon material in anadditional array of openings through the alternating layers of the firstoxide material and the nitride material.
 12. The method of claim 10,wherein forming the temporary support material comprises forming a thirdoxide material in an additional array of openings through thealternating layers of the first oxide material and the nitride material.13. The method of claim 10, wherein forming the temporary supportmaterial further comprises forming the polysilicon material and thethird oxide material in alternating rows of the additional array ofopenings through the alternating layers of the first oxide material andthe nitride material.
 14. The method of claim 10, wherein removing theportion of the temporary support material comprises removing thepolysilicon material from the first subset of the additional array ofopenings through the alternating layers of the first oxide material andthe nitride material.
 15. The method of claim 10, further comprisingforming an additional temporary support material through the alternatinglayers of the first oxide material and the nitride material subsequentto forming the metal material.
 16. The method of claim 10, furthercomprising removing the metal material from the array of openingsthrough the second oxide material.
 17. A method of processing memory,comprising: forming a first oxide material in a serpentine openingthrough alternating layers of a second oxide material and a nitridematerial; removing portions of the alternating layers of the secondoxide material and the nitride material to form a staircase structure;forming an array of openings through the second oxide material and thealternating layers of the first oxide material and the nitride material;forming a third oxide material in a portion of the array of openings;removing the layers of the nitride material; and forming a metalmaterial in voids resulting from the removal of the layers of nitridematerial.
 18. The method of claim 17, wherein removing the portions ofthe alternating layers of the second oxide material and the nitridematerial to form the staircase structure comprises: performing an etchoperation on a peripheral area of a semiconductor wafer on which theportions of the alternating layers of the second oxide material and thenitride material are formed.
 19. The method of claim 17, wherein formingthe array of openings comprises: forming a first section of the array ofopenings through the staircase structure; forming the third oxidematerial in the portion of the array of openings, wherein the portion ofthe array of openings is a portion of the first section of the array ofopenings; forming a polysilicon material in a different portion of thefirst section of the array of the openings; forming a second section ofthe array of openings through the first oxide material in the serpentineopening subsequent to forming the first section of the array ofopenings; and removing the polysilicon material prior to removing thelayers of the nitride material.
 20. The method of claim 19, furthercomprising, forming an additional metal material in the differentportion of the first section of the array of the openings subsequent toremoving the polysilicon material.
 21. The method of claim 20, furthercomprising: forming an oxide liner material in the different portion ofthe first section of the array of the openings prior to forming theadditional metal material; and forming the additional metal material onthe oxide liner material in the different portion of the first sectionof the array of the openings.
 22. The method of claim 17, furthercomprising performing a selective etch operation, relative to the first,second, and third oxide materials, to remove the metal material from thearray of openings.